Simulation for SiC power electronic device developments

Onuma, Toshiharu*; Miyashita, Atsumi; Yoshikawa, Masahito; Tsuchida, Hidekazu*; Iwasawa, Misako*

Heisei-21-Nendo Sentan Kenkyu Shisetsu Kyoyo Sokushin Jigyo "Chikyu Shimyureta Sangyo Senryaku Riyo Puroguramu" Riyo Seika Hokokusho, p.21 - 27, 2010/07

http://www.jamstec.go.jp/es/jp/project/sangyou_report/H21_report.html

Silicon carbide, being a wide-band-gap semiconductor, is an attractive material in the development of electronic devices operated under extreme conditions such as high power, high temperature, and high radiation. SiC is particularly attractive for use in MOS technology because among the compound semiconductors only silicon carbide has the thermal oxide SiO, which is a good insulator. However, it is known that SiO/SiC interfaces have a higher density of interface traps than SiO/Si interfaces and that the channel mobility of MOS devices is much lower than theoretically expected values. In order to improve these characteristics, it is important to understand the thermal oxidation process at the SiO/SiC interface. We performed large-scale first-principles molecular dynamics simulations of the SiO/SiC interface oxidation process. We also performed large-scale first-principles molecular dynamics simulations to generate amorphous SiO/SiC interface.